Assembly in SMD of printed circuits: equipment and features
In order to carry out SMD assembly (the putting together of surface assembly components), we have the following equipment at our disposal:
Seven automatic machines with which we may position 70,000 components by hour. We can assemble any type of component which is to be found on the market ranging from the smallest 0402 format chips to the largest 50*50 mm ones, and QFPs, PLCCs, BGAs, etc.
Three re-melting furnaces, which may be fully shaped to achieve any temperature profile and adapted for welding by paste and adhesive.
Three automatic silk-screening machines which may be shaped to all parameters in order to deposit the amount of paste or glue required in each component.
Centring chambers of the printed circuit, which monitor the images by detecting any type of error prior to silk-screening.
